JPH01166505A - 電子部品の筺体及びその製造方法 - Google Patents

電子部品の筺体及びその製造方法

Info

Publication number
JPH01166505A
JPH01166505A JP62325679A JP32567987A JPH01166505A JP H01166505 A JPH01166505 A JP H01166505A JP 62325679 A JP62325679 A JP 62325679A JP 32567987 A JP32567987 A JP 32567987A JP H01166505 A JPH01166505 A JP H01166505A
Authority
JP
Japan
Prior art keywords
mold
substrate
film
housing
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62325679A
Other languages
English (en)
Japanese (ja)
Other versions
JPH055361B2 (en]
Inventor
Nobuyuki Yagi
信行 八木
Jiro Inagaki
二郎 稲垣
Kozo Morita
森田　幸三
Yasutoshi Kako
加来　泰俊
Nobuyuki Kikuchi
信幸 菊地
Shinji Mizuno
伸二 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teikoku Tsushin Kogyo Co Ltd
Original Assignee
Teikoku Tsushin Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teikoku Tsushin Kogyo Co Ltd filed Critical Teikoku Tsushin Kogyo Co Ltd
Priority to JP62325679A priority Critical patent/JPH01166505A/ja
Priority to DE88201651T priority patent/DE3884718T2/de
Priority to DE8888201646T priority patent/DE3875045T2/de
Priority to EP88201651A priority patent/EP0304112B1/en
Priority to EP88201646A priority patent/EP0307977B1/en
Priority to KR1019880010628A priority patent/KR910001748B1/ko
Priority to KR1019880010627A priority patent/KR910001747B1/ko
Priority to US07/234,952 priority patent/US4935718A/en
Priority to US07/234,946 priority patent/US4928082A/en
Priority to US07/244,165 priority patent/US4978491A/en
Publication of JPH01166505A publication Critical patent/JPH01166505A/ja
Priority to US07/447,441 priority patent/US5071611A/en
Publication of JPH055361B2 publication Critical patent/JPH055361B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Adjustable Resistors (AREA)
JP62325679A 1987-08-21 1987-12-22 電子部品の筺体及びその製造方法 Granted JPH01166505A (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP62325679A JPH01166505A (ja) 1987-12-22 1987-12-22 電子部品の筺体及びその製造方法
DE88201651T DE3884718T2 (de) 1987-08-21 1988-07-29 Gehäuse aus vergossenem Kunststoff für einen elektronischen Teil mit einer biegsamen Schaltung.
DE8888201646T DE3875045T2 (de) 1987-09-07 1988-07-29 Gehaeuse aus vergossenem kunststoff fuer einen elektronischen teil mit flachem kabel.
EP88201651A EP0304112B1 (en) 1987-08-21 1988-07-29 Molded resin casing of electronic part incorporating flexible board
EP88201646A EP0307977B1 (en) 1987-09-07 1988-07-29 Molded resin casing of electronic part with flat cable
KR1019880010628A KR910001748B1 (ko) 1987-09-07 1988-08-20 플랫 케이블을 구비한 전자 부품 주형 수지 케이싱
KR1019880010627A KR910001747B1 (ko) 1987-08-21 1988-08-20 유연 보드 합체식 전자 부품 주형 수지 케이싱
US07/234,952 US4935718A (en) 1987-08-21 1988-08-22 Molded resin casing of electronic part incorporating flexible board
US07/234,946 US4928082A (en) 1987-09-07 1988-08-22 Molded resin casing of electronic part with flexible flat cable
US07/244,165 US4978491A (en) 1987-08-21 1988-09-13 Molded resin casing of electronic part incorporating flexible board
US07/447,441 US5071611A (en) 1987-09-07 1989-12-07 Method of making molded resin casing of electronic part with flat cable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62325679A JPH01166505A (ja) 1987-12-22 1987-12-22 電子部品の筺体及びその製造方法

Publications (2)

Publication Number Publication Date
JPH01166505A true JPH01166505A (ja) 1989-06-30
JPH055361B2 JPH055361B2 (en]) 1993-01-22

Family

ID=18179505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62325679A Granted JPH01166505A (ja) 1987-08-21 1987-12-22 電子部品の筺体及びその製造方法

Country Status (1)

Country Link
JP (1) JPH01166505A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344819A (ja) * 2005-06-09 2006-12-21 Teikoku Tsushin Kogyo Co Ltd 電子部品用基体の製造方法
JP2016122737A (ja) * 2014-12-25 2016-07-07 帝国通信工業株式会社 金属端子と回路基板の成形による接続方法及び接続体

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06315873A (ja) * 1993-04-30 1994-11-15 Toudentsuu:Kk グレーチング取付け構造に用いられるボルト・ナット保持工具及びこれを用いたグレーチングの取付け方法
GB0323684D0 (en) 2003-10-09 2003-11-12 Jagotec Ag Improvements in or relating to organic compounds

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217601A (ja) * 1984-04-12 1985-10-31 アルプス電気株式会社 可変抵抗器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217601A (ja) * 1984-04-12 1985-10-31 アルプス電気株式会社 可変抵抗器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344819A (ja) * 2005-06-09 2006-12-21 Teikoku Tsushin Kogyo Co Ltd 電子部品用基体の製造方法
JP2016122737A (ja) * 2014-12-25 2016-07-07 帝国通信工業株式会社 金属端子と回路基板の成形による接続方法及び接続体

Also Published As

Publication number Publication date
JPH055361B2 (en]) 1993-01-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term